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Abstract

In the paper the problems of investigation of scabbing process under interaction of solitary waves of compression (SWC) with free surface in Cu crystallite having both ideal structure, and containing structural defects is discussed. In particular, the grain boundary near the free surface was set. The calculations were carried out within the framework of molecular dynamics method.
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晶体结痂断裂微观水平的计算机模拟
本文讨论了在具有理想结构和含有结构缺陷的铜晶体中,孤立压缩波与自由表面相互作用下结痂过程的研究问题。特别是在自由表面附近设置了晶界。计算是在分子动力学方法的框架内进行的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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