{"title":"Study on the Thermal-Humidity Reliability of High Power LED Module","authors":"K. Pan, Jing Huang, Yu Guo, Renzhang Chen","doi":"10.1109/ICDMA.2013.317","DOIUrl":null,"url":null,"abstract":"LED lighting becomes the forth generation green lighting. However, in terms of LED development and large-scale application, the reliability of LED has become one of the technical bottlenecks. This paper carried out the research on the thermal-humidity reliability of high power LED module by the means of experiment and simulation, which mainly aims at the reliability problems existed in high power LED products. Thermal-humidity experiments which takes high power LED module with 10W as the experimental sample and simulation analysis based on FEM (Finite Element Method) software ANSYS are carried out. The results show that, high temperature is the main factor which affects the thermal-humidity reliability of high power LED module.","PeriodicalId":403312,"journal":{"name":"2013 Fourth International Conference on Digital Manufacturing & Automation","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Fourth International Conference on Digital Manufacturing & Automation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICDMA.2013.317","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
LED lighting becomes the forth generation green lighting. However, in terms of LED development and large-scale application, the reliability of LED has become one of the technical bottlenecks. This paper carried out the research on the thermal-humidity reliability of high power LED module by the means of experiment and simulation, which mainly aims at the reliability problems existed in high power LED products. Thermal-humidity experiments which takes high power LED module with 10W as the experimental sample and simulation analysis based on FEM (Finite Element Method) software ANSYS are carried out. The results show that, high temperature is the main factor which affects the thermal-humidity reliability of high power LED module.