BEOL Reliability for More- Than-Moore Devices

Abstract

For Moore's law technology qualifications, the Back-End of Line (BEOL) reliability focuses on electromigration, stress migration, Time Dependent Dielectric Breakdown (TDDB), and Chip-Package Interaction (CPI). For More-Than-Moore technology qualifications, some additional BEOL reliability tests are often required. Power semiconductors used in automotive applications are exposed to higher temperatures and higher currents than devices used in consumer products. Hence, the BEOL reliability includes power-temperature cycling stresses, high current pulsed stresses, high temperature storage above 200°C, and unique package connections such as 2mil Cu wirebonds or Cu clips.