Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding

2016 IEEE International Electron Devices Meeting (IEDM) Pub Date : 2016-12-01 DOI:10.1109/IEDM.2016.7838375
Y. Kagawa, N. Fujii, K. Aoyagi, Y. Kobayashi, S. Nishi, N. Todaka, S. Takeshita, J. Taura, H. Takahashi, Y. Nishimura, K. Tatani, M. Kawamura, H. Nakayama, T. Nagano, K. Ohno, H. Iwamoto, S. Kadomura, T. Hirayama
{"title":"Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding","authors":"Y. Kagawa, N. Fujii, K. Aoyagi, Y. Kobayashi, S. Nishi, N. Todaka, S. Takeshita, J. Taura, H. Takahashi, Y. Nishimura, K. Tatani, M. Kawamura, H. Nakayama, T. Nagano, K. Ohno, H. Iwamoto, S. Kadomura, T. Hirayama","doi":"10.1109/IEDM.2016.7838375","DOIUrl":null,"url":null,"abstract":"We have successfully mass-produced novel stacked back-illuminated CMOS image sensors (BI-CIS). In the new CIS, we introduced advanced Cu2Cu hybrid bonding that we had developed. The electrical test results showed that our highly robust Cu2Cu hybrid bonding achieved remarkable connectivity and reliability. The performance of image sensor was also investigated and our novel stacked BI-CIS showed favorable results.","PeriodicalId":186544,"journal":{"name":"2016 IEEE International Electron Devices Meeting (IEDM)","volume":"177 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"84","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2016.7838375","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 84

Abstract

We have successfully mass-produced novel stacked back-illuminated CMOS image sensors (BI-CIS). In the new CIS, we introduced advanced Cu2Cu hybrid bonding that we had developed. The electrical test results showed that our highly robust Cu2Cu hybrid bonding achieved remarkable connectivity and reliability. The performance of image sensor was also investigated and our novel stacked BI-CIS showed favorable results.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
采用先进Cu2Cu混合键合技术的新型堆叠CMOS图像传感器
我们成功量产了新型堆叠背照CMOS图像传感器(BI-CIS)。在新的CIS中，我们引入了我们开发的先进的Cu2Cu杂化键。电学测试结果表明，我们的高鲁棒性Cu2Cu混合键合取得了显著的连通性和可靠性。对图像传感器的性能也进行了研究，我们的新型堆叠BI-CIS显示了良好的效果。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
2016 IEEE International Electron Devices Meeting (IEDM)
2016 IEEE International Electron Devices Meeting (IEDM)
自引率
0.00%
发文量
0
期刊最新文献
SOI technology for quantum information processing Sustainable electronics for nano-spacecraft in deep space missions Current status and challenges of the modeling of organic photodiodes and solar cells Triboelectric energy harvester with an ultra-thin tribo-dielectric layer by initiated CVD and investigation of underlying physics in the triboelectricity 256×256, 100kfps, 61% Fill-factor time-resolved SPAD image sensor for microscopy applications
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们：info@booksci.cn
Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1