Realization of high-Q inductors using wirebonding technology

Sung-Jin Kim, Yong-Goo Lee, Sang-Ki Yun, Hai-Young Lee
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引用次数: 18

Abstract

Two types of novel high-Q vertical on-chip inductors using wirebonding technology are proposed for low cost and high performance Si-RFIC's. The new inductors show significant improvements of the quality factor and the self-resonant frequency. Their measured maximum quality factors are about 3-times higher than those of the planar spiral inductors (7 for 3.4 nH, 6 for 5 nH) at most. From these experimental results, the bondwire inductors are expected to greatly improve the performance and the production cost of Si-RFIC's.
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利用线键技术实现高q电感
为实现低成本、高性能的Si-RFIC,提出了两种采用线键技术的新型高q垂直片上电感。新型电感器的质量因数和自谐振频率均有显著提高。测量到的最大质量因子是平面螺旋电感的3倍左右(3.4 nH为7,5 nH为6)。从这些实验结果来看,键合线电感有望大大提高Si-RFIC的性能和生产成本。
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