Application of nonparametric approach to the rapid thermal processing systems modeling

Abstract

Rapid thermal processing systems (RTP) are currently being developed for the single-wafer manufacturing of integrated circuits. In order to achieve slip-free and uniform processing, it is necessary to maintain near uniform temperature distribution over the wafer. Recent innovations in RTP design have provided the ability to achieve temperature uniformity. One recent approach employs multiple concentric circular rings of lamps that can be controlled independently so as to adjust the heat flux over the wafer to maintain a reasonable uniform temperature over a range of operating conditions. To solve problems of RTP systems design and control problem solutions, the construction of a process model is required. In this paper, the authors introduce a nonparametric method of RTP system modeling.