Temperature scaling of nanoscale silicon MOSFETs

V. Sverdlov, Y. Naveh, K. Likharev
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引用次数: 2

Abstract

We have combined a 1D model of double-gate MOSFETs with ultrathin intrinsic channel, with a simple model of power consumption in digital integrated circuits, to calculate the temperature dependence of the minimum total (static + dynamic) power P and the optimal power supply voltage V DD . The results are strongly dependent on the circuit speed assumptions. If the current trend of speed scaling with the critical size reduction is sustained, both P and V DD saturate as soon as T is decreased below 100 K. On the other hand, if the high speed condition is removed, transistors may operate in the subthreshold region and minimum value of P scales as T 2 while the optimum value of V DD drops as T. This reduction is, however, limited by thermal fluctuations, leading to a different scaling, V DD T 1/2 and P T 1 , for low temperatures and/or large circuit densities. Because of this limitation, deep cooling of CMOS circuits may make sense only in very special cases.
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纳米硅mosfet的温度缩放
我们将具有超薄固有通道的双栅mosfet的一维模型与数字集成电路的简单功耗模型相结合,计算了最小总(静态+动态)功率P和最佳电源电压V DD的温度依赖性。结果强烈依赖于电路速度的假设。如果当前速度随临界尺寸减小的趋势持续下去,当T降至100k以下时,P和vdd都达到饱和。另一方面,如果去除高速条件,晶体管可能工作在亚阈值区域,P尺度的最小值为t2,而V DD的最佳值为T。然而,这种降低受到热波动的限制,导致不同的尺度,V DD t1 /2和P t1 1,对于低温和/或大电路密度。由于这种限制,CMOS电路的深度冷却可能只在非常特殊的情况下才有意义。
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