The Creation of an Information Based Manufacturing Framework for micro devices assembly: A discussion of the path planning and virtual assembly modules

Gobinath Narayanasamy, J. Cecil, A. Trivedi
{"title":"The Creation of an Information Based Manufacturing Framework for micro devices assembly: A discussion of the path planning and virtual assembly modules","authors":"Gobinath Narayanasamy, J. Cecil, A. Trivedi","doi":"10.1109/COASE.2006.326930","DOIUrl":null,"url":null,"abstract":"This paper outlines the design of an information based manufacturing framework for micro devices assembly (MDA). The focus of discussion is on the virtual reality based assembly environment along with the use of path planning components. The virtual environment is implemented using C++ and Open Inventor. Two path planning software modules have also been implemented to demonstrate the overall approach. A physical micro assembly cell is used to accomplish the proposed assembly plans.","PeriodicalId":116108,"journal":{"name":"2006 IEEE International Conference on Automation Science and Engineering","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE International Conference on Automation Science and Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/COASE.2006.326930","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

This paper outlines the design of an information based manufacturing framework for micro devices assembly (MDA). The focus of discussion is on the virtual reality based assembly environment along with the use of path planning components. The virtual environment is implemented using C++ and Open Inventor. Two path planning software modules have also been implemented to demonstrate the overall approach. A physical micro assembly cell is used to accomplish the proposed assembly plans.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
微器件装配信息化制造框架的构建:路径规划与虚拟装配模块探讨
本文概述了一种面向微器件装配的信息化制造框架的设计。讨论的重点是基于虚拟现实的装配环境以及路径规划组件的使用。虚拟环境是使用c++和Open Inventor实现的。两个路径规划软件模块的实现也演示了整体方法。物理微装配单元用于完成所提出的装配计划。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Multi-Period Production Capacity Planning for Integrated Product and Production System Design Introduction to Automated Material Handling Systems in LCD Panel Production Lines Heuristic Methods to Solve the Alternative Subgraphs Assembly Line Balancing Problem Research of Multi-operation Quality Control based on Minimum Quality Loss Distribution network design with random demand and unreliable suppliers
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1