{"title":"Thermographic inspection method for quality assessment of power semiconductors in the manufacture of power electronics modules","authors":"M. Schaulin, M. Oppermann, T. Zerna","doi":"10.1109/ESTC.2018.8546435","DOIUrl":null,"url":null,"abstract":"In recent years, the market volume for power electronics has grown steadily and the development was assisted by innovative packaging technologies. Increased productivity and profitability requirements demand continuous improvement of production processes. New or complementary solutions for inline-capable diagnostics are required and should comply with the quality, reliability and cost-effectiveness requirements of the present and the future. In the quality testing of modern power electronic assemblies, the junction between power semiconductor and substrate is a challenge. Today, process control of this junction is mainly based on X-ray inspection, but thermography seems to be a promising approach. It works contact-free, fast and can determine the thermal properties of the package.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546435","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
In recent years, the market volume for power electronics has grown steadily and the development was assisted by innovative packaging technologies. Increased productivity and profitability requirements demand continuous improvement of production processes. New or complementary solutions for inline-capable diagnostics are required and should comply with the quality, reliability and cost-effectiveness requirements of the present and the future. In the quality testing of modern power electronic assemblies, the junction between power semiconductor and substrate is a challenge. Today, process control of this junction is mainly based on X-ray inspection, but thermography seems to be a promising approach. It works contact-free, fast and can determine the thermal properties of the package.
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