{"title":"Signal-to-Noise Ratio Measurements of Sound Source and Speaker System-in-Package (SiP)","authors":"H. Sasaki, Y. Fujimura, T. Murakami, H. Terai","doi":"10.1109/SPI.2008.4558371","DOIUrl":null,"url":null,"abstract":"We have developed a system-in-a-package (SiP) consisting of a sound source LSI and a speaker amplifier LSI for mobile applications, and have measured its signal-to-noise ratio (SNR). The sound source LSI chip is stacked on the speaker amplifier LSI chip with inserting a silicon spacer between these chips. Two types of interposers were applied to the SiP: one-metal polyimide tape and a two-metal glass epoxy board. When the output voltage of the speaker LSI was 5 Vp-p, the SNR of the digital-analog converter in the sound source LSI did not change. When it was 15 Vp-p, the SNR was about 1.5 dB worse than with 5 Vp-p. The SNR when the one-metal tape was used was about 1 dB worse than when the two-metal epoxy board was used. The noise source for this degradation was apparently the class-D amplifier in the speaker LSI. These results should be useful in the design for mixed-signal SiPs.","PeriodicalId":142239,"journal":{"name":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 12th IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2008.4558371","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
We have developed a system-in-a-package (SiP) consisting of a sound source LSI and a speaker amplifier LSI for mobile applications, and have measured its signal-to-noise ratio (SNR). The sound source LSI chip is stacked on the speaker amplifier LSI chip with inserting a silicon spacer between these chips. Two types of interposers were applied to the SiP: one-metal polyimide tape and a two-metal glass epoxy board. When the output voltage of the speaker LSI was 5 Vp-p, the SNR of the digital-analog converter in the sound source LSI did not change. When it was 15 Vp-p, the SNR was about 1.5 dB worse than with 5 Vp-p. The SNR when the one-metal tape was used was about 1 dB worse than when the two-metal epoxy board was used. The noise source for this degradation was apparently the class-D amplifier in the speaker LSI. These results should be useful in the design for mixed-signal SiPs.
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