Donghwnag Shin, Jin‐Cheol Jeong, Seong-Mo Moon, I. Yom, Dong-Wook Kim
{"title":"Compact Ku-band GaAs multifunction chip for SATCOM phased arrays","authors":"Donghwnag Shin, Jin‐Cheol Jeong, Seong-Mo Moon, I. Yom, Dong-Wook Kim","doi":"10.1109/EURAD.2015.7346334","DOIUrl":null,"url":null,"abstract":"This paper presents a compact Ku-band GaAs multifunction chip using commercial GaAs pHEMT technologies for SATCOM applications. The multifunction chip consists of a 4-bit phase shifter and a 4-bit attenuator with a serial-to-parallel converter (SPC) but the size is less than 7.6 mm2. Typical value of RMS attenuation error and RMS phase error are 0.5 dB and 3.5°, respectively in the frequency range of 12-18 GHz. The SPC-integrated multifunction chip leads to a simplification in the control interface and a reduction in the cost of module assembly.","PeriodicalId":376019,"journal":{"name":"2015 European Radar Conference (EuRAD)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 European Radar Conference (EuRAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EURAD.2015.7346334","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
This paper presents a compact Ku-band GaAs multifunction chip using commercial GaAs pHEMT technologies for SATCOM applications. The multifunction chip consists of a 4-bit phase shifter and a 4-bit attenuator with a serial-to-parallel converter (SPC) but the size is less than 7.6 mm2. Typical value of RMS attenuation error and RMS phase error are 0.5 dB and 3.5°, respectively in the frequency range of 12-18 GHz. The SPC-integrated multifunction chip leads to a simplification in the control interface and a reduction in the cost of module assembly.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
