T. Reimann, R. Krummer, U. Franke, J. Petzoldt, L. Lorenz
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引用次数: 9
Abstract
Investigations of the transient chip temperature of IGBT and diode in power modules are presented in this paper. The calculation of chip temperature and power losses occurs on-line in a microcontroller. Advanced practical results achieved in a step down converter are shown at different load cycles and output frequencies with the same average load current. An analysis of results and errors is also shown.
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