{"title":"The effect of current on stationary contact behaviour","authors":"B. Bennett","doi":"10.1109/HOLM.1988.16128","DOIUrl":null,"url":null,"abstract":"A general time-dependent model has been developed that is based on electromigration and describes the effect of current on stationary electrical contacts, as used in telecommunication circuits. Model predictions were found to be in excellent agreement with experimental results obtained from gold and copper contacts. Based on these results it is proposed that sealing current, which is a 5-30-mA DC continuous current applied to splices to maintain their integrity, works by establishing a steady state between contact growth due to electromigration and contact degradation due to oxidation and/or corrosion.<<ETX>>","PeriodicalId":191800,"journal":{"name":"Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"214 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOLM.1988.16128","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

Abstract

A general time-dependent model has been developed that is based on electromigration and describes the effect of current on stationary electrical contacts, as used in telecommunication circuits. Model predictions were found to be in excellent agreement with experimental results obtained from gold and copper contacts. Based on these results it is proposed that sealing current, which is a 5-30-mA DC continuous current applied to splices to maintain their integrity, works by establishing a steady state between contact growth due to electromigration and contact degradation due to oxidation and/or corrosion.<>
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电流对固定接触行为的影响
一个基于电迁移的通用时间依赖模型已经被开发出来,它描述了电流对固定电触点的影响,如在电信电路中使用的那样。模型预测结果与从金和铜触点得到的实验结果非常吻合。基于这些结果,我们提出密封电流,即施加在接头上的5-30 ma直流连续电流,通过在由于电迁移引起的接触生长和由于氧化和/或腐蚀引起的接触退化之间建立稳定状态来工作。
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