{"title":"Advanced flash memory technology and trends for file storage application","authors":"S. Aritome","doi":"10.1109/IEDM.2000.904429","DOIUrl":null,"url":null,"abstract":"This paper describes a high density flash memory technology suitable for file storage application. Requirements for file storage memory are low cost, high-speed programming and erasing, low power consumption and good endurance characteristics. In order to satisfy these requirements, key technologies of self-aligned STI (SA-STI) cell, uniform FN-FN program/erase scheme and multi-level-cell (MLC) technology have been developed. By using SA-STI technology, small cell size of 4F/sup 2/ (F: feature size) can be realized. Reliable tunnel oxide can be also obtained because the floating gate does not overlap the STI corner. As a result, reliable 512 Mbit flash memories with 0.145 um/sup 2/ cell size under 0.175 /spl mu/m design rule have been newly developed based on these technologies, as well as 0.25 /spl mu/m 256 Mbit. Moreover, MLC technology combined with this small cell size of 4F/sup 2/ can reduce bit cost more, and can expand the file storage market in the near future.","PeriodicalId":276800,"journal":{"name":"International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138)","volume":"67 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"38","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2000.904429","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 38
Abstract
This paper describes a high density flash memory technology suitable for file storage application. Requirements for file storage memory are low cost, high-speed programming and erasing, low power consumption and good endurance characteristics. In order to satisfy these requirements, key technologies of self-aligned STI (SA-STI) cell, uniform FN-FN program/erase scheme and multi-level-cell (MLC) technology have been developed. By using SA-STI technology, small cell size of 4F/sup 2/ (F: feature size) can be realized. Reliable tunnel oxide can be also obtained because the floating gate does not overlap the STI corner. As a result, reliable 512 Mbit flash memories with 0.145 um/sup 2/ cell size under 0.175 /spl mu/m design rule have been newly developed based on these technologies, as well as 0.25 /spl mu/m 256 Mbit. Moreover, MLC technology combined with this small cell size of 4F/sup 2/ can reduce bit cost more, and can expand the file storage market in the near future.