Interdigitated LDMOS

Jaejune Jang, Kyuheon Cho, D. Jang, Minhwan Kim, Changjoon Yoon, Junsung Park, H.-S. Oh, Chiho Kim, Hyoungsoo Ko, Keunho Lee, Sangbae Yi
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引用次数: 11

Abstract

Novel Interdigitated LDMOS is experimented resulting in best in class RSP-BVDSS performance (21.8mΩ-mm2 with BVDSS of 47V) in comparison to published LDMOS. RSP improvement is made through additional current path by removing STI region in drift area. Breakdown voltage is maintained with lateral field plate effect from side of the current path. Proposed Interdigitated LDMOS satisfies reliability criteria (HCI, snap back) as 40V device. All of this is obtained without any process change.
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互相交叉LDMOS
与已发表的LDMOS相比,新型交叉数字化LDMOS的RSP-BVDSS性能最佳(21.8mΩ-mm2 BVDSS为47V)。通过去除漂移区域的STI区域,通过增加电流路径来改善RSP。击穿电压维持在电流通路侧面的侧场板效应。所提出的交叉数字化LDMOS满足40V器件的可靠性标准(HCI、回跳)。所有这些都是在没有任何工艺改变的情况下获得的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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