Soldering tests with biodegradable printed circuit boards

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI:10.1109/SIITME.2013.6743641

A. Géczy, T. Garami, B. Kovács, D. Nagy, L. Gál, M. Ruszinkó, I. Hajdu

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引用次数: 6

Abstract

The paper presents soldering tests on biodegradable printed circuit boards (PCB) focusing on different alternative base materials. The aim of the work was to investigate and optimize different low-temperature soldering profiles on cellulose-acetate (CA) and polylactide (PLA) biopolymer-based PCBs with the application of special lead-free solder alloy suited for the temperatures. The investigations were focused on the minimization of the heating effect on the heat-sensitive biopolymers, where on the other hand, sufficient thermal energy is required to melt the solder alloys. The soldering profiles were created with a custom vapour phase soldering (VPS) approach where the heat transfer is controlled with an adaptive height-setting, temperature tracking sample holder. The profiles were evaluated according to their heating factor values. The soldered joints were evaluated with X-Ray microscopy and Shear Tests. The deformation of the PCB tracks was also investigated. The preliminary results reveal the priority of CA for further experiments.

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生物可降解印刷电路板的焊接试验

本文介绍了生物可降解印刷电路板(PCB)的焊接试验，重点介绍了不同基材的焊接试验。这项工作的目的是研究和优化基于纤维素-醋酸酯(CA)和聚乳酸(PLA)生物聚合物的pcb的不同低温焊接配置，并应用适合该温度的特殊无铅焊料合金。研究的重点是最小化热敏性生物聚合物的热效应，另一方面，需要足够的热能来熔化焊料合金。焊接轮廓是用定制的气相焊接(VPS)方法创建的，其中传热是通过自适应高度设置和温度跟踪样品支架来控制的。根据其热因子值对剖面进行评价。通过x射线显微镜和剪切试验对焊接接头进行了评估。研究了PCB轨迹的变形。初步结果显示了CA在进一步实验中的优先性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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