Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743659
M. Daraban, D. Pitica
When it comes to transmission lines the common causes for signal integrity (SI) problems are the mismatches caused during the routing process. From all the possible causes for mismatches, vias are the most common ones. In the literature, different approaches are proposed to resolve the SI problems caused by vias: stitching vias, matching the driver output impedance to the transmission line's new value [1]. Stitching vias can be used when printed circuit boards (PCBs) are used with more than four layers. Additionally a smaller value for the series-matching resistor improves the signal rise/fall time, but also increases the ringing effect's amplitude. In the paper, a solution for improving the signal at the receiver is proposed that can be used even on four layer PCB. The proposed solution keeps the improvements obtained through matching the driver output to the transmission line's modified impedance, without increasing the ringing effect amplitude.
{"title":"Progressive transmission line matching when encountering via mismatching","authors":"M. Daraban, D. Pitica","doi":"10.1109/SIITME.2013.6743659","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743659","url":null,"abstract":"When it comes to transmission lines the common causes for signal integrity (SI) problems are the mismatches caused during the routing process. From all the possible causes for mismatches, vias are the most common ones. In the literature, different approaches are proposed to resolve the SI problems caused by vias: stitching vias, matching the driver output impedance to the transmission line's new value [1]. Stitching vias can be used when printed circuit boards (PCBs) are used with more than four layers. Additionally a smaller value for the series-matching resistor improves the signal rise/fall time, but also increases the ringing effect's amplitude. In the paper, a solution for improving the signal at the receiver is proposed that can be used even on four layer PCB. The proposed solution keeps the improvements obtained through matching the driver output to the transmission line's modified impedance, without increasing the ringing effect amplitude.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123698960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743684
D. Aiordachioaie, M. Andrei
Change detection problem refers to the detection of abnormal regimes and incipient faults of electrical circuits, devices or equipments. The problem is coming more and more important as the requirements for high and constant quality, low maintenance and high reliability of complex electronic products are continuously increasing. Classical methods use statistical signal processing techniques, various frequency transforms and techniques based on models. In all these approaches the moment of change detection must be known as precisely as possible. This work presents preliminary results in solving change detection problem based on two methods. The first one is based on signal modeling and detects changes by observing the changes in the model's parameters. The second one is based on Renyi entropy processing and it uses direct, simple and efficient parameter estimation methods to describe the circuit's behavior. Both methods could serve as references for other more advanced techniques, e.g. based on frequency transforms and complex optimization criteria.
{"title":"On change detection for improved reliability","authors":"D. Aiordachioaie, M. Andrei","doi":"10.1109/SIITME.2013.6743684","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743684","url":null,"abstract":"Change detection problem refers to the detection of abnormal regimes and incipient faults of electrical circuits, devices or equipments. The problem is coming more and more important as the requirements for high and constant quality, low maintenance and high reliability of complex electronic products are continuously increasing. Classical methods use statistical signal processing techniques, various frequency transforms and techniques based on models. In all these approaches the moment of change detection must be known as precisely as possible. This work presents preliminary results in solving change detection problem based on two methods. The first one is based on signal modeling and detects changes by observing the changes in the model's parameters. The second one is based on Renyi entropy processing and it uses direct, simple and efficient parameter estimation methods to describe the circuit's behavior. Both methods could serve as references for other more advanced techniques, e.g. based on frequency transforms and complex optimization criteria.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115243369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743657
Aurelian Botau, C. Negrea
Nowadays the size of Liquid Crystal Displays (LCD) displays on the market has a continuous ascending trend which demands higher and higher resolutions. The backlight system of a LCD is the structure that offers light which passes through the liquid crystals layer. No matter what method is used, it has to provide a high luminous intensity and a uniform light distribution on screen visible surface. One significant problem in such designs is the difference in light intensity of individual LEDs due to their different junction temperatures. This paper presents a method of optimization for a LED matrix assembly, where the main purpose is to improve the thermal uniformity on the PCB in order to reduce the luminous flux output difference between the devices, while also maintaining the junction temperatures in the acceptable operating range. As a consequence, the need of custom pattern diffusers used in the LCD displays as light uniformity corrections structures can be eliminated. The method implies defining the geometry for the cooling areas on the PCB by using a specific formula obtained after curve fitting FEM simulation results.
{"title":"PCB layout optimization for LED backlight module using FEM simulation","authors":"Aurelian Botau, C. Negrea","doi":"10.1109/SIITME.2013.6743657","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743657","url":null,"abstract":"Nowadays the size of Liquid Crystal Displays (LCD) displays on the market has a continuous ascending trend which demands higher and higher resolutions. The backlight system of a LCD is the structure that offers light which passes through the liquid crystals layer. No matter what method is used, it has to provide a high luminous intensity and a uniform light distribution on screen visible surface. One significant problem in such designs is the difference in light intensity of individual LEDs due to their different junction temperatures. This paper presents a method of optimization for a LED matrix assembly, where the main purpose is to improve the thermal uniformity on the PCB in order to reduce the luminous flux output difference between the devices, while also maintaining the junction temperatures in the acceptable operating range. As a consequence, the need of custom pattern diffusers used in the LCD displays as light uniformity corrections structures can be eliminated. The method implies defining the geometry for the cooling areas on the PCB by using a specific formula obtained after curve fitting FEM simulation results.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122585256","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743645
A. Géczy, L. Tersztyanszky, B. Illés, A. Kemler, A. Szabó
The paper presents a novel approach on an emerging problem in lead-free reflow soldering technology. The trend of miniaturized SMD device application and the increasing component density cause newfound problems during the reflow process. In this work, the issue of Printed Circuit Board (PCB) shrinkage is inspected in the environment of automotive electronics production. The shrinkage effect results in linear offset on the double sided PCB along the (XY) dimensions during stencil printing of the second reflow pass. The observed phenomenon causes tombstone and bridging failures on specific fine-pitch SMD components. To investigate and obtain deeper understanding of the phenomenon, a new method was developed for the measurement of shrinkage. The novel measurement method is evaluated with a less-productive, but more precise measurement device. With the collected data it is possible to approximate the overall shrinkage of the given product. After introducing a compensation step on the stencil design (based on the measurements), it is possible to significantly reduce the quantity of failures caused by the shrinkage.
{"title":"Reducing lead-free soldering failures caused by Printed Circuit Board shrinkage","authors":"A. Géczy, L. Tersztyanszky, B. Illés, A. Kemler, A. Szabó","doi":"10.1109/SIITME.2013.6743645","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743645","url":null,"abstract":"The paper presents a novel approach on an emerging problem in lead-free reflow soldering technology. The trend of miniaturized SMD device application and the increasing component density cause newfound problems during the reflow process. In this work, the issue of Printed Circuit Board (PCB) shrinkage is inspected in the environment of automotive electronics production. The shrinkage effect results in linear offset on the double sided PCB along the (XY) dimensions during stencil printing of the second reflow pass. The observed phenomenon causes tombstone and bridging failures on specific fine-pitch SMD components. To investigate and obtain deeper understanding of the phenomenon, a new method was developed for the measurement of shrinkage. The novel measurement method is evaluated with a less-productive, but more precise measurement device. With the collected data it is possible to approximate the overall shrinkage of the given product. After introducing a compensation step on the stencil design (based on the measurements), it is possible to significantly reduce the quantity of failures caused by the shrinkage.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"34 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125721374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743690
M. Pantazica, P. Svasta, H. Wohlrabe, K. Wolter
The aim of this paper is to present the most recent results obtained after conducting a complex experiment designed with the help of the Design of Experiments (DoE) method. The purpose of this experiment is to evaluate the dependencies between the layout design and the production quality of surface mount boards. The last part of this experiment is focused on studying the effects of solder voids on the reliability of solder joints. Solder joints are investigated and evaluated with the help of an X-Ray equipment. Based on the X-Ray images, the void area in a solder joint is measured (in pixels). The statistical analysis has revealed that all factors considered to have an influence on the void formation in this experiment are significant. Moreover all the interactions between these factors are statistically significant. The largest void content is obtained in case of microMELF components, chemSn surface finish and solder paste type C. As opposed to our expectations, the void area is the smallest in case of Vapour Phase Soldering.
{"title":"Factors influencing the formation of voids in chip component solder joints","authors":"M. Pantazica, P. Svasta, H. Wohlrabe, K. Wolter","doi":"10.1109/SIITME.2013.6743690","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743690","url":null,"abstract":"The aim of this paper is to present the most recent results obtained after conducting a complex experiment designed with the help of the Design of Experiments (DoE) method. The purpose of this experiment is to evaluate the dependencies between the layout design and the production quality of surface mount boards. The last part of this experiment is focused on studying the effects of solder voids on the reliability of solder joints. Solder joints are investigated and evaluated with the help of an X-Ray equipment. Based on the X-Ray images, the void area in a solder joint is measured (in pixels). The statistical analysis has revealed that all factors considered to have an influence on the void formation in this experiment are significant. Moreover all the interactions between these factors are statistically significant. The largest void content is obtained in case of microMELF components, chemSn surface finish and solder paste type C. As opposed to our expectations, the void area is the smallest in case of Vapour Phase Soldering.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115192102","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743678
S. Pop, V. Bande, D. Pitica
This paper presents a data acquisition system used for AC/DC current monitoring. The developed system use the current transducer manufactured by LEM [3]. The output signal of the transducer is a voltage that is proportional to the current magnitude. To compute the current, the outputs signal is sampled with high frequency. The AC rms (root mean square) value is obtained by processing the sample values during the multiple periods of alternative signal. The number of periods is chosen according to the dynamic of process. For data acquisition and processing is used a microcontroller, ATMEGA 328. The acquisition system has six input channels, connected at the 10-bit ADC inputs channels of microcontroller. The ADC has ±2LSB absolute accuracy and the sensor accuracy is of ±1 %. The systematic error has a major component into the total error; this error may be reduced, soft, through the calibration process.
{"title":"Six channel AC/DC current data logger used in industrial application","authors":"S. Pop, V. Bande, D. Pitica","doi":"10.1109/SIITME.2013.6743678","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743678","url":null,"abstract":"This paper presents a data acquisition system used for AC/DC current monitoring. The developed system use the current transducer manufactured by LEM [3]. The output signal of the transducer is a voltage that is proportional to the current magnitude. To compute the current, the outputs signal is sampled with high frequency. The AC rms (root mean square) value is obtained by processing the sample values during the multiple periods of alternative signal. The number of periods is chosen according to the dynamic of process. For data acquisition and processing is used a microcontroller, ATMEGA 328. The acquisition system has six input channels, connected at the 10-bit ADC inputs channels of microcontroller. The ADC has ±2LSB absolute accuracy and the sensor accuracy is of ±1 %. The systematic error has a major component into the total error; this error may be reduced, soft, through the calibration process.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"25 5","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120854895","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743670
R. Fang, Chia-fen Liu, Chieh-Yu Liao, Chun-Long Wang
In this paper, a simple transmission line method is proposed to precisely predict the center frequency of the compact high-low impedance transformer. It has been shown that the center frequency of the return loss stays at 3 GHz even though the electrical length θT reduces greatly. Besides, the compact high-low impedance transformer with θT = 60° yields 35.89% area-saving and maintains the same 15-dB bandwidth as compared with the conventional quarter-wavelength transformer. In order to verify the simulation results, back-to-back transformers are fabricated and measured where the measurement results are in good agreement with the simulation results.
{"title":"High-low impedance transformer using transmission line method","authors":"R. Fang, Chia-fen Liu, Chieh-Yu Liao, Chun-Long Wang","doi":"10.1109/SIITME.2013.6743670","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743670","url":null,"abstract":"In this paper, a simple transmission line method is proposed to precisely predict the center frequency of the compact high-low impedance transformer. It has been shown that the center frequency of the return loss stays at 3 GHz even though the electrical length θT reduces greatly. Besides, the compact high-low impedance transformer with θT = 60° yields 35.89% area-saving and maintains the same 15-dB bandwidth as compared with the conventional quarter-wavelength transformer. In order to verify the simulation results, back-to-back transformers are fabricated and measured where the measurement results are in good agreement with the simulation results.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125896408","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743673
Muhammad Ahmed Khan, S. F. Jawed, Muhammad Owais Khan, Osama Mazhar
Health is one of the major issues for normal existence of human life and it is a global agenda to increase the health care facilities for the peoples who don't have an immediate access to these facilities and are living in rural and undeveloped areas. From the beginning of twenty first century field of E-health has been developed rapidly to encounter these problems properly. The healthcare infrastructure gaining betterment day by day under the shadow of E-health technologies, where using mobile phones are becoming an efficient tool in monitoring and transmitting different physiological signals. Cardiac sound is an initiative physiological parameter that is helpful for diagnosing changes in physiological conditions and disease. Hence in this research a tele auscultation system is designed for the transmission of cardiac sounds to the medical practitioner from distant place by using an electronic stethoscope through a GSM (Global System for mobile communication) technology. The physiological signals of low frequency and voltages, after amplification and filtration can be easily transmitted with low noise interference in the signal. This portable wireless cardiac sound transmission device can send heart sounds of a patient just in one call. The information about the placement of stethoscope at different position of heart can be transmitted to medical practitioner through a SMS (Short Messaging Service). For the purpose stated a GSM modem of SIM900D is used which is interfaced with a Microcontroller Unit in order to control and send instructions to modem using AT (Attention) commands. Therefore, it is concluded that the cardiac sounds of a patient can be transmitted from the distant areas to the medical practitioner for the purpose of diagnosing many illness of the patients.
{"title":"An innovative approach towards E-health in development of tele auscultation system for heart using GSM mobile communication technology","authors":"Muhammad Ahmed Khan, S. F. Jawed, Muhammad Owais Khan, Osama Mazhar","doi":"10.1109/SIITME.2013.6743673","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743673","url":null,"abstract":"Health is one of the major issues for normal existence of human life and it is a global agenda to increase the health care facilities for the peoples who don't have an immediate access to these facilities and are living in rural and undeveloped areas. From the beginning of twenty first century field of E-health has been developed rapidly to encounter these problems properly. The healthcare infrastructure gaining betterment day by day under the shadow of E-health technologies, where using mobile phones are becoming an efficient tool in monitoring and transmitting different physiological signals. Cardiac sound is an initiative physiological parameter that is helpful for diagnosing changes in physiological conditions and disease. Hence in this research a tele auscultation system is designed for the transmission of cardiac sounds to the medical practitioner from distant place by using an electronic stethoscope through a GSM (Global System for mobile communication) technology. The physiological signals of low frequency and voltages, after amplification and filtration can be easily transmitted with low noise interference in the signal. This portable wireless cardiac sound transmission device can send heart sounds of a patient just in one call. The information about the placement of stethoscope at different position of heart can be transmitted to medical practitioner through a SMS (Short Messaging Service). For the purpose stated a GSM modem of SIM900D is used which is interfaced with a Microcontroller Unit in order to control and send instructions to modem using AT (Attention) commands. Therefore, it is concluded that the cardiac sounds of a patient can be transmitted from the distant areas to the medical practitioner for the purpose of diagnosing many illness of the patients.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127112763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743655
T. Patarau, D. Petreus, R. Etz, C. Orian, E. Darvasi, T. Frențiu
The paper presents an improved flexible method to control a vaporizer filament using a digitally controlled switch mode power supply. The vaporizer is used in portable plasma equipment for heavy metals detection. The temperature profile needed for the probe vaporization can be set using the proposed digitally controlled converter through a PC interface.
{"title":"Study and implementation of a vaporizer used in plasma equipment for heavy metals detection","authors":"T. Patarau, D. Petreus, R. Etz, C. Orian, E. Darvasi, T. Frențiu","doi":"10.1109/SIITME.2013.6743655","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743655","url":null,"abstract":"The paper presents an improved flexible method to control a vaporizer filament using a digitally controlled switch mode power supply. The vaporizer is used in portable plasma equipment for heavy metals detection. The temperature profile needed for the probe vaporization can be set using the proposed digitally controlled converter through a PC interface.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"282 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120879869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743692
M. Varga, K. Wolter
We propose a new teaching module called “Biology for Electrical Engineers” that should help engineering students to understand and apply important biological concepts. Until now, only few educational institutes in the world offer similar training despite an increasing tendency of interdisciplinarity across research activities. The teaching resources will include overviews of important biological topics, modeling and computational as well as laboratory exercises. The knowledge and expertise acquired should support engineers in designing and fabricating more prominent biosensor- and electronic devices.
{"title":"New frontiers in education — Training in Biology for Electrical Engineers","authors":"M. Varga, K. Wolter","doi":"10.1109/SIITME.2013.6743692","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743692","url":null,"abstract":"We propose a new teaching module called “Biology for Electrical Engineers” that should help engineering students to understand and apply important biological concepts. Until now, only few educational institutes in the world offer similar training despite an increasing tendency of interdisciplinarity across research activities. The teaching resources will include overviews of important biological topics, modeling and computational as well as laboratory exercises. The knowledge and expertise acquired should support engineers in designing and fabricating more prominent biosensor- and electronic devices.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124060964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：