Development of a cooling system for 6U module based on Elbrus microprocessor

Abstract

The article discusses the design features of cooling systems for compact Eurocard format modules based on the Elbrus microprocessor. The issue of ensuring the necessary thermal regime of the processor module in the space shortage conditions in order to accommodate the cooling system has been solved. The estimated calculation showed the underperformance of the passive cooling of the Elbrus-4S microprocessor with a heat output of 60 W. In this regard, a 3D model of an active cooling system with 5.5×10.3×4.6 cm dimensions was developed. Thermal calculations were performed using the SolidWorks Flow Simulation program in order to optimize the radiator geometry and fan speed. It was assumed that an optimized cooling system will ensure that the chip temperature of the Elbrus-4S processor is no more than +87 °C (at an ambient temperature of +55 °C). Based on the results of the study, three prototypes were produced for testing. Further tests conducted on prototypes showed the efficiency of the cooling system and the high accuracy of the simulation results. During tests in a climatic chamber at a temperature of +55 °C, the temperature on the microprocessor chip did not exceed +84 °C (a difference of 3 °C compared to the estimated one).