K. Imai, K. Yamaguchi, T. Kudo, N. Kimizuka, H. Onishi, A. Ono, Y. Nakahara, Y. Goto, K. Noda, S. Masuoka, S. Ito, K. Matsui, K. Ando, E. Hasegawa, T. Ohashi, N. Oda, K. Yokoyama, T. Takewaki, S. Sone, T. Horiuchi
{"title":"CMOS device optimization for system-on-a-chip applications","authors":"K. Imai, K. Yamaguchi, T. Kudo, N. Kimizuka, H. Onishi, A. Ono, Y. Nakahara, Y. Goto, K. Noda, S. Masuoka, S. Ito, K. Matsui, K. Ando, E. Hasegawa, T. Ohashi, N. Oda, K. Yokoyama, T. Takewaki, S. Sone, T. Horiuchi","doi":"10.1109/IEDM.2000.904354","DOIUrl":null,"url":null,"abstract":"This paper describes a 0.13-/spl mu/m-generation CMOS technology optimized for system-on-a-chip (SoC) applications. The wide-range of performances obtained using a triple gate oxide and multiple threshold voltage control allows the SoC to operate at high speed with low standby power. Core CMOS transistors, which have a 1.9 nm gate oxide and a 95-nm physical gate length, show an excellent drive current of 740/335 /spl mu/A//spl mu/m at 1.2 V. Low power CMOS transistors have a standby current of only 2-0.2 pA//spl mu/m with a 2.6-nm gate oxide and a 120-nm gate length. This technology has also been used to make a 1.4-/spl mu/m/sup 2/ loadless 4T SRAM cell as well as a 2.5-/spl mu/m/sup 2/ 6T cell. The wiring RC delay has been reduced by integrating Cu interconnects with a low-k \"ladder-oxide\" layer.","PeriodicalId":276800,"journal":{"name":"International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138)","volume":"153 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2000.904354","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 17
Abstract
This paper describes a 0.13-/spl mu/m-generation CMOS technology optimized for system-on-a-chip (SoC) applications. The wide-range of performances obtained using a triple gate oxide and multiple threshold voltage control allows the SoC to operate at high speed with low standby power. Core CMOS transistors, which have a 1.9 nm gate oxide and a 95-nm physical gate length, show an excellent drive current of 740/335 /spl mu/A//spl mu/m at 1.2 V. Low power CMOS transistors have a standby current of only 2-0.2 pA//spl mu/m with a 2.6-nm gate oxide and a 120-nm gate length. This technology has also been used to make a 1.4-/spl mu/m/sup 2/ loadless 4T SRAM cell as well as a 2.5-/spl mu/m/sup 2/ 6T cell. The wiring RC delay has been reduced by integrating Cu interconnects with a low-k "ladder-oxide" layer.