{"title":"A system comparison between water and air-borne cooling systems for telephone exchanges","authors":"J. Kolte, H. Zirath","doi":"10.1109/INTLEC.1989.88358","DOIUrl":null,"url":null,"abstract":"The authors compare three cooling systems (two airborne and one waterborne) for telephone exchanges: (1) cooling through a false floor; (2) conventional air conditioning; and (2) cooling with natural convection coils, for instance using the Ericsson cooling system ERICOOL. The waterborne natural-convection system appears to be the most advantageous. The system has the following advantages: lowest power consumption; easiest achievement of cooling reserve in case of main failure; best working environment in the switching room; greatest development potential for future electronic packaging structures with increased power densities.<<ETX>>","PeriodicalId":272740,"journal":{"name":"Conference Proceedings., Eleventh International Telecommunications Energy Conference","volume":"133 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Proceedings., Eleventh International Telecommunications Energy Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INTLEC.1989.88358","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The authors compare three cooling systems (two airborne and one waterborne) for telephone exchanges: (1) cooling through a false floor; (2) conventional air conditioning; and (2) cooling with natural convection coils, for instance using the Ericsson cooling system ERICOOL. The waterborne natural-convection system appears to be the most advantageous. The system has the following advantages: lowest power consumption; easiest achievement of cooling reserve in case of main failure; best working environment in the switching room; greatest development potential for future electronic packaging structures with increased power densities.<>
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