{"title":"Experimental studies on bonding pressure in wire bonding","authors":"Rongzhi Gao, Lei Han, J. Zhong","doi":"10.1109/HDP.2006.1707578","DOIUrl":null,"url":null,"abstract":"The bonding pressure is one of the most important factors to the bonding strength in ultrasonic wire bonding. The relations between bonding pressure and bonding strength of 0.3 mm Al wire were experimentally studied. The bonding pressure of the U3000 ultrasonic wedge bonder was calibrated; the influence on the voltage, current was studied. The result show that only moderate conditions of bonding pressure leads to the largest bonding strength","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HDP.2006.1707578","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The bonding pressure is one of the most important factors to the bonding strength in ultrasonic wire bonding. The relations between bonding pressure and bonding strength of 0.3 mm Al wire were experimentally studied. The bonding pressure of the U3000 ultrasonic wedge bonder was calibrated; the influence on the voltage, current was studied. The result show that only moderate conditions of bonding pressure leads to the largest bonding strength
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
