Interrogation of system state for damage assessment in lead-free electronics subjected to thermo-mechanical loads

P. Lall, C. Bhat, M. Hande, V. More, R. Vaidya, R. Pandher, J. Suhling, K. Goebel
{"title":"Interrogation of system state for damage assessment in lead-free electronics subjected to thermo-mechanical loads","authors":"P. Lall, C. Bhat, M. Hande, V. More, R. Vaidya, R. Pandher, J. Suhling, K. Goebel","doi":"10.1109/ECTC.2008.4550086","DOIUrl":null,"url":null,"abstract":"Requirements for system availability for ultra-high reliability electronic systems such as airborne and space electronic systems are driving the need for advanced heath monitoring techniques for early detection of the onset of damage. Aerospace-electronic systems usually face a very harsh environment, requiring them to survive the high strain rates, e.g. during launch and re-entry and thermal environments including extreme low and high temperatures. Traditional health monitoring methodologies have relied on reactive methods of failure detection often providing little on no insight into the remaining useful life of the system. Detection of system-state significantly prior to catastrophic failure can significantly impact the reliability and availability of electronic systems. Previously, Lall, et. al. [2004, 2005, 2006, 2007] have developed methodologies for health management and interrogation of system state of electronic systems based on leading indicators. Examples of damage pre-cursors include micro-structural evolution, intermetallics, stress and stress gradients. Pre-cursors have been developed for both eutectic 63Sn37Pb and Sn4Ag0.5Cu alloy systems on a variety of area-array architectures. In this paper, a mathematical approach for interrogation of system state under cyclic thermo-mechanical stresses has been developed for 6-different leadfree solder alloy systems. Thermal cycles may be experienced by electronics due to power cycling or environmental cycling. Data has been collected for leading indicators of failure for alloy systems including, Sn3Ag0.5Cu, Sn3Ag0.7Cu, SnlAg0.5Cu, Sn0.3Ag0.5Cu0.1Bi, Sn0.2Ag0.5Cu0.1Bi0.1Ni, 96.5Sn3.5Ag second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology presented resides in the pre-failure space of the system in which no macro-indicators such as cracks or delamination exist. Systems subjected to thermo-mechanical damage have been interrogated for system state and the computed damage state correlated with known imposed damage. The approach involves the use of condition monitoring devices which can be interrogated for damage proxies at finite time-intervals. Interrogation techniques are based on derivation of damage proxies, and system prior damage based non-linear least-squares methods including the Levenberg-Marquardt Algorithm. The system's residual life is computed based on residual-life computation algorithms.","PeriodicalId":378788,"journal":{"name":"2008 58th Electronic Components and Technology Conference","volume":"75 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"49","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 58th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2008.4550086","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 49

Abstract

Requirements for system availability for ultra-high reliability electronic systems such as airborne and space electronic systems are driving the need for advanced heath monitoring techniques for early detection of the onset of damage. Aerospace-electronic systems usually face a very harsh environment, requiring them to survive the high strain rates, e.g. during launch and re-entry and thermal environments including extreme low and high temperatures. Traditional health monitoring methodologies have relied on reactive methods of failure detection often providing little on no insight into the remaining useful life of the system. Detection of system-state significantly prior to catastrophic failure can significantly impact the reliability and availability of electronic systems. Previously, Lall, et. al. [2004, 2005, 2006, 2007] have developed methodologies for health management and interrogation of system state of electronic systems based on leading indicators. Examples of damage pre-cursors include micro-structural evolution, intermetallics, stress and stress gradients. Pre-cursors have been developed for both eutectic 63Sn37Pb and Sn4Ag0.5Cu alloy systems on a variety of area-array architectures. In this paper, a mathematical approach for interrogation of system state under cyclic thermo-mechanical stresses has been developed for 6-different leadfree solder alloy systems. Thermal cycles may be experienced by electronics due to power cycling or environmental cycling. Data has been collected for leading indicators of failure for alloy systems including, Sn3Ag0.5Cu, Sn3Ag0.7Cu, SnlAg0.5Cu, Sn0.3Ag0.5Cu0.1Bi, Sn0.2Ag0.5Cu0.1Bi0.1Ni, 96.5Sn3.5Ag second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology presented resides in the pre-failure space of the system in which no macro-indicators such as cracks or delamination exist. Systems subjected to thermo-mechanical damage have been interrogated for system state and the computed damage state correlated with known imposed damage. The approach involves the use of condition monitoring devices which can be interrogated for damage proxies at finite time-intervals. Interrogation techniques are based on derivation of damage proxies, and system prior damage based non-linear least-squares methods including the Levenberg-Marquardt Algorithm. The system's residual life is computed based on residual-life computation algorithms.
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热机械载荷下无铅电子元件损伤评估系统状态的研究
对超高可靠性电子系统(如机载和空间电子系统)系统可用性的要求,推动了对先进健康监测技术的需求,以便及早发现损害的发生。航空航天电子系统通常面临非常恶劣的环境,要求它们在高应变率下存活,例如在发射和再入以及热环境(包括极低和高温)期间。传统的健康监测方法依赖于故障检测的反应性方法,通常对系统的剩余使用寿命几乎没有任何了解。在灾难性故障发生前对系统状态进行检测,对电子系统的可靠性和可用性有重要影响。此前,Lall等人[2004,2005,2006,2007]开发了基于领先指标的电子系统健康管理和系统状态询问方法。损伤前体的例子包括微观结构演化、金属间化合物、应力和应力梯度。在不同的面阵结构上,已经开发出用于共晶63Sn37Pb和Sn4Ag0.5Cu合金体系的前驱体。本文针对6种不同的无铅焊料合金体系,建立了循环热-机械应力作用下系统状态的数学分析方法。由于电源循环或环境循环,电子产品可能会经历热循环。在循环热机械载荷作用下,对Sn3Ag0.5Cu、Sn3Ag0.7Cu、SnlAg0.5Cu、Sn0.3Ag0.5Cu0.1Bi、Sn0.2Ag0.5Cu0.1Bi0.1Ni、96.5Sn3.5Ag秒级互连等合金系统的主要失效指标进行了数据采集。所提出的方法存在于系统的失效前空间,其中不存在裂纹或分层等宏观指标。系统受到热-机械损伤询问系统状态和计算损伤状态与已知的施加损伤。该方法涉及使用状态监测设备,可以在有限的时间间隔内询问损坏代理。询问技术是基于损伤代理的推导和基于系统先验损伤的非线性最小二乘方法,包括Levenberg-Marquardt算法。根据剩余寿命计算算法计算系统的剩余寿命。
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