Study of Phase Shift of Lock-In Thermography and Its Application in 2.5D IC Package

Yu-Ting Lin, B. Lai, C. Tsao, Yi-Sheng Lin, Yu-Hsiang Hsiao
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Abstract

In this study we demonstrate the use of phase shift of lock-in thermography (LIT) a powerful technique in characterizing the Z profile of 2.5D packages. It is interesting to have a good understanding of how a given package structure correlates with LIT phase shift. We create a short defect to validate the experimental phase model and the approach would be useful in applying to other type of 2.5D lCs.
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锁相热成像相移研究及其在2.5D IC封装中的应用
在这项研究中,我们展示了锁相热成像(LIT)的使用,这是一种表征2.5D封装Z剖面的强大技术。很好地理解给定的封装结构如何与LIT相移相关是很有趣的。我们创建了一个短缺陷来验证实验阶段模型,并且该方法将用于应用于其他类型的2.5D lc。
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