Robust packaging solutions through innovative designs in clip-QFN

Abstract

The quality and success of a product starts from a right design. Geometry of lead frames and clips are crucial components in manufacturability and long term reliability of clip-QFN packages. Every product has a unique set of component lay-out and configuration; and this doesn't mean outright BOM (bill of material) compatibility for new product built on similar qualified package. Die dimension and component stack up for instance require careful considerations. During design stage, features such as stress relief and geometry should be comprehended. Clip design also indicates the assembly manufacturability of the product. Clip frames must maintain a robust design in adapting to the specific packaging requirement while maintaining the mechanical integrity to withstand multiple assembly operations. Poor designs can lead to reliability issues most notable during thermal cycle testing. This paper will cover the entire clip-QFN design journey, the clip-QFN top defects reduction and elimination that TI Clark is aspiring toward.