Floorplan driven leakage power aware IP-based SoC design space exploration

Aseem Gupta, N. Dutt, F. Kurdahi, K. Khouri, M. Abadir
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引用次数: 7

Abstract

Multi-million gate system-on-chip (SoC) designs increasingly rely on intellectual property (IP) blocks. However, due to technology scaling the leakage power consumption of the IP blocks has risen thus leading to possible thermal runaway. In IP-based design there has been a disconnect between system level design and physical level steps such as floorplanning which can lead to failures in manufactured chips. This necessitates coupling between system level and physical level design steps. The leakage power of an IP-block increases with its temperature which is dependent on the SoC's floorplan due to thermal diffusion. We have observed that different floorplans of the same SoC can have up to 3X difference in leakage power. Hence the system designer needs to be aware of this design space between floorplans and leakage power. We propose a leakage aware exploration (LAX) framework which enables the system designer to create this design space early in the design cycle and provides an opportunity to make changes in the system design. We show the size of the design space generated by applying LAX on ten industrial SoC designs from Freescale Semiconductor Inc. and observe that the leakage power can vary by as much as 190% for 65% difference in the inactive area.
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平面图驱动的泄漏功率感知基于ip的SoC设计空间探索
数以百万计的栅极片上系统(SoC)设计越来越依赖于知识产权(IP)模块。然而,由于技术的扩展,IP模块的泄漏功耗已经上升,从而导致可能的热失控。在基于ip的设计中,系统级设计和物理级步骤(如布局规划)之间存在脱节,这可能导致制造芯片出现故障。这就需要将系统关卡和物理关卡设计步骤结合起来。由于热扩散,ip块的泄漏功率随着温度的增加而增加,这取决于SoC的平面图。我们观察到,相同SoC的不同平面图在泄漏功率上可能有高达3倍的差异。因此,系统设计师需要意识到平面图和泄漏功率之间的设计空间。我们提出了一个泄漏感知探索(LAX)框架,它使系统设计师能够在设计周期的早期创建这个设计空间,并提供了在系统设计中进行更改的机会。我们展示了通过将LAX应用于飞思卡尔半导体公司的十个工业SoC设计而产生的设计空间的大小,并观察到在非活动区域中65%的差异,泄漏功率可以变化多达190%。
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