100nm Gate length enhancement-mode In0.4Ga0.6As MOSFETs with InGaP interfacial layer and Al2O3 as gate oxide

H. Chang, B. Sun, Z. Gong, J. Niu, S. K. Wang, H. Liu
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引用次数: 1

Abstract

An enhancement-mode implant-free In0.4Ga0.6As metal oxide semiconductor field effect transistors (MOSFETs) on GaAs substrate is demonstrated. The device features atomic layer deposition (ALD) 8 nm Al2O3 gate oxide layer on 5 nm InGaP interfacial layer and is fabricated on GaAs substrate. Devices with 100 nm gate-length exhibit a threshold voltage of 0.72 V, an extrinsic transconductance of 170 mS/mm, and a saturation drain current of 250 mA/mm. The current gain cutoff frequency, fT, and the maximum frequency of oscillation, fmax, of 79 GHz and 180 GHz were obtained, respectively. This work suggests that InGaAs MOSFETs with InGaP interfacial layer on GaAs can be used in single power supply RF applications.
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以InGaP界面层和Al2O3为栅极氧化物的100nm栅极长度增强模式In0.4Ga0.6As mosfet
在GaAs衬底上制备了一种无植入的增强型In0.4Ga0.6As金属氧化物半导体场效应晶体管(mosfet)。该器件采用原子层沉积(ALD)技术,在5nm InGaP界面层上制备8nm Al2O3栅极氧化层,并在GaAs衬底上制备。栅极长度为100 nm的器件的阈值电压为0.72 V,外部跨导为170 mS/mm,饱和漏极电流为250 mA/mm。得到电流增益截止频率fT为79 GHz,最大振荡频率fmax为180 GHz。这项工作表明,在GaAs上具有InGaP接口层的InGaAs mosfet可以用于单电源射频应用。
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