Polyimides as High Temperature Capacitor Dielectrics

J. Ho, M. Schroeder
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引用次数: 2

Abstract

Nearly five decades of effort has focused on identifying and developing new polymer capacitor films for higher-than-ambient temperature applications, but simultaneous demands of processability, dielectric permittivity, thermal conductivity, dielectric breakdown strength, and self-clearing capability limit the number of available materials. Demands on these criteria are even more stringent in growing numbers of applications demanding high power performance. Aromatic polyimides, though not a panacea, are a class of heat-resistant polymers of great interest to researchers as capacitor dielectrics because of good thermal and mechanical stability. In this chapter, the key aspects and advantages of metallized polymer film capacitors are compared to analogous alternative technologies (polymer-film-metal-foil, ceramic, and electrolytic capacitors), followed by a comprehensive review of commercial resin development leading up to recent research on polyimides targeted for operating temperature above 150°C. Finally, this chapter provides a brief discussion on the recent effort on combining computation and synthesis to design polymers with desirable dielectric properties.
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聚酰亚胺作为高温电容器介质
近五十年来,人们一直致力于识别和开发用于高于环境温度应用的新型聚合物电容器薄膜,但同时对可加工性、介电介电常数、导热性、介电击穿强度和自清除能力的要求限制了可用材料的数量。在越来越多要求高功率性能的应用中,对这些标准的要求更加严格。芳香族聚酰亚胺虽然不是万灵药,但由于具有良好的热稳定性和机械稳定性,是一类耐热聚合物,作为电容器介质引起了研究人员的极大兴趣。在本章中,金属化聚合物薄膜电容器的关键方面和优势与类似的替代技术(聚合物-薄膜-金属箔,陶瓷和电解电容器)进行了比较,然后对商业树脂的发展进行了全面回顾,导致最近针对150°C以上工作温度的聚酰亚胺的研究。最后,本章简要讨论了最近将计算与合成相结合来设计具有理想介电性能的聚合物的努力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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