Metallurgical study and tribological properties of edge card connector spring/tab interface

Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts Pub Date : 1900-01-01 DOI:10.1109/HOLM.1988.16100

E. Hsue, R. Bayer

{"title":"Metallurgical study and tribological properties of edge card connector spring/tab interface","authors":"E. Hsue, R. Bayer","doi":"10.1109/HOLM.1988.16100","DOIUrl":null,"url":null,"abstract":"Summary form only given, as follows. The influence of composite metallurgical structure on the tribological behavior of an edge-card connector was studied. The study centered on the metallurgy of the card tab, which is a multilayer structure consisting of a printed circuit board with an overplated copper layer, nickel, hard gold, and soft gold. These experiments were performed under both dry friction and thin-film polyolester lubricated conditions. The thickness of each was found to alter the frictional characteristics of the surface. The experimental data were found to agree with Finkin's theoretical model for solid-film lubrication. The role of the soft-gold layer was identified as a friction/wear riser, rather than a solid lubricant. It was found that the addition of a minimum layer of lubricant can provide lower friction on contact surface and eliminate fretting wear. The lubricant also made the behavior less sensitive to the metallurgy. When the amount of lubricant was increased the coefficient of friction stayed almost the same from thin-film to flooded conditions. The difference in wear between the dry and thin film lubrication conditions was minor.<<ETX>>","PeriodicalId":191800,"journal":{"name":"Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOLM.1988.16100","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

Abstract

Summary form only given, as follows. The influence of composite metallurgical structure on the tribological behavior of an edge-card connector was studied. The study centered on the metallurgy of the card tab, which is a multilayer structure consisting of a printed circuit board with an overplated copper layer, nickel, hard gold, and soft gold. These experiments were performed under both dry friction and thin-film polyolester lubricated conditions. The thickness of each was found to alter the frictional characteristics of the surface. The experimental data were found to agree with Finkin's theoretical model for solid-film lubrication. The role of the soft-gold layer was identified as a friction/wear riser, rather than a solid lubricant. It was found that the addition of a minimum layer of lubricant can provide lower friction on contact surface and eliminate fretting wear. The lubricant also made the behavior less sensitive to the metallurgy. When the amount of lubricant was increased the coefficient of friction stayed almost the same from thin-film to flooded conditions. The difference in wear between the dry and thin film lubrication conditions was minor.<>

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边卡连接器弹簧/卡片界面的冶金学研究和摩擦学性能

仅给出摘要形式，如下。研究了复合金相组织对边卡式连接器摩擦学性能的影响。该研究主要集中在卡片标签的冶金上，这是一种多层结构，由印刷电路板组成，上面镀有铜层、镍、硬金和软金。这些实验是在干摩擦和薄膜聚脂润滑条件下进行的。发现每一层的厚度都会改变表面的摩擦特性。实验数据与Finkin的固体膜润滑理论模型一致。软金层的作用被确定为摩擦/磨损立管，而不是固体润滑剂。研究发现，添加最少一层润滑油可以降低接触面摩擦，消除微动磨损。润滑油的加入也降低了合金的性能对冶金的敏感性。当润滑油用量增加时，摩擦系数从薄膜状态到淹水状态基本保持不变。干润滑和薄膜润滑条件下的磨损差异很小

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Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts

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