{"title":"Device Simulation for Future Technologies","authors":"M. Stettler, R. Kotlyar, T. Rakshit, T. Linton","doi":"10.1109/IWCE.2009.5091105","DOIUrl":null,"url":null,"abstract":"Simulation approaches used in Intel to evaluate the applicability of new devices and materials for future microprocessor technologies are reviewed. Examples discussed include the evaluation of highly stressed materials, III -V HEMT devices, and carbon nanoribbons. The techniques employed are similar to those used in the research community, but focused on efficient evaluation within a versatile infrastructure that works for both development and research.","PeriodicalId":443119,"journal":{"name":"2009 13th International Workshop on Computational Electronics","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 13th International Workshop on Computational Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWCE.2009.5091105","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Simulation approaches used in Intel to evaluate the applicability of new devices and materials for future microprocessor technologies are reviewed. Examples discussed include the evaluation of highly stressed materials, III -V HEMT devices, and carbon nanoribbons. The techniques employed are similar to those used in the research community, but focused on efficient evaluation within a versatile infrastructure that works for both development and research.
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