{"title":"A 92.4% Efficient, 5.5V:0.4-1.2V, FCML Converter with Modified Ripple Injection Control for Fast Transient Response and Capacitor Balancing","authors":"Jan S. Rentmeister, J. Stauth","doi":"10.1109/CICC48029.2020.9075902","DOIUrl":null,"url":null,"abstract":"This paper presents a highly-integrated, 5-level flying capacitor multilevel (FCML) dc-dc converter that uses augmented ripple-injection control to achieve self-startup, fast transient response, and flying capacitor voltage balance. The converter provides 5.5 V:0.4 V-1.2 V step down with robust load- and line-rejection, peak efficiency of 92.4 % and >80 % efficiency at a 13.8:1 conversion ratio with peak current up to 1.4 A. All power devices, bootstrap capacitors, and control functions are integrated on chip; flying and bypass capacitors are die-attached using a custom assembly process.","PeriodicalId":409525,"journal":{"name":"2020 IEEE Custom Integrated Circuits Conference (CICC)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Custom Integrated Circuits Conference (CICC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC48029.2020.9075902","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12
Abstract
This paper presents a highly-integrated, 5-level flying capacitor multilevel (FCML) dc-dc converter that uses augmented ripple-injection control to achieve self-startup, fast transient response, and flying capacitor voltage balance. The converter provides 5.5 V:0.4 V-1.2 V step down with robust load- and line-rejection, peak efficiency of 92.4 % and >80 % efficiency at a 13.8:1 conversion ratio with peak current up to 1.4 A. All power devices, bootstrap capacitors, and control functions are integrated on chip; flying and bypass capacitors are die-attached using a custom assembly process.
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