Thickness measurement of multi-layered structures using SD-OCT Imaging System

Sunil Gaikwad, Khushi Patni, P. Arulmozhivarman, S. Balamurugan, R. Makkar
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Abstract

We present the method to measure the thickness of multi-layered structure using an indigenously developed SD-OCT system. The SD-OCT system is based on low coherence Michelson interferometry and generates 2D images(B-Scan) with axial resolution of 5 microns. The method developed processes these 2D images in MATLAB and yields information on thickness of each underlying layer in terms of pixels. Samples such as scotch tape and cover slip with known thickness have been used to validate this method. The thickness results obtained using the developed algorithm are in good correlation with the actual physical values within very tight tolerance. This method can be applied to determine thickness of outer paint of aircraft, thickness of fruits, leaves and stems in fruits agro sector besides many other applications.
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基于SD-OCT成像系统的多层结构厚度测量
我们提出了一种利用自主开发的SD-OCT系统测量多层结构厚度的方法。SD-OCT系统基于低相干迈克尔逊干涉测量,产生轴向分辨率为5微米的2D图像(b扫描)。该方法在MATLAB中处理这些二维图像,并以像素为单位产生每个底层的厚度信息。用已知厚度的透明胶带和盖条等样品验证了该方法。在非常严格的公差范围内,利用所开发的算法得到的厚度结果与实际物理值有很好的相关性。该方法可用于飞机外漆厚度的测定,水果农业部门果实、叶、茎厚度的测定等。
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