Electrical Characteristics of Polycrystalline 3C-SiC Thin Films

J. Ahn, G. Chung
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引用次数: 1

Abstract

Since the properties of the polycrystalline 3C-SiC thin film heteroepitaxially grown on Si (n-type, p-type) or SiO2/Si is superior to any other that of single crystal SiC, it has attractive potentials for hash environments-, RF-, Bio-M/NEMS. Thus, we have investigated the electronic characteristics of the diodes having that a p-n junction diode was fabricated with 3C-SiC on p-type Si substrate, and Schottky diodes were fabricated with Au deposited on poly 3C-SiC/Si (n-type) and poly 3C-SiC/SiO2/Si respectively, for using extreme temperature surroundings M/NEMS with low leakage current. These diodes were annealed at 300, 400, and 500degC, and measured IV characteristics according to different annealing temperatures to investigate their electronic properties. SEM (scanning electron microscopy) and XKD (X-ray diffraction) have investigated the surface morphology of Au deposited on 3C-SiC thin films and the formed phases, respectively.
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多晶3C-SiC薄膜的电学特性
由于在Si (n型,p型)或SiO2/Si上异质外延生长的多晶3C-SiC薄膜的性能优于任何其他单晶SiC,因此它在hash -, RF-, Bio-M/NEMS环境中具有吸引人的潜力。因此,我们研究了在p型Si衬底上用3C-SiC制备p-n结二极管和在n型和sic /SiO2/Si衬底上分别镀Au制备肖特基二极管的电子特性,用于低漏电流的极端温度环境M/NEMS。分别在300、400和500℃下退火,并根据不同的退火温度测量其IV特性,以研究其电子特性。SEM(扫描电子显微镜)和XKD (x射线衍射)分别研究了沉积在3C-SiC薄膜上的Au的表面形貌和形成的相。
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