{"title":"Predicting System Level ESD Robustness Using a Comprehensive Modelling Approach","authors":"C. Russ, Michael Ammer, K. Esmark","doi":"10.23919/EOS/ESD.2018.8509746","DOIUrl":null,"url":null,"abstract":"The system level ESD robustness of ICs is simulated including all external components. An electro-thermal model is calibrated to power profiles of IC failures. Results provide great confidence for prediction of the joint effectiveness of board- or chip-level protection in reaction to changing system requirements or to different ESD guns.","PeriodicalId":328499,"journal":{"name":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EOS/ESD.2018.8509746","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
The system level ESD robustness of ICs is simulated including all external components. An electro-thermal model is calibrated to power profiles of IC failures. Results provide great confidence for prediction of the joint effectiveness of board- or chip-level protection in reaction to changing system requirements or to different ESD guns.
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