G. White, S. Dalmia, L. Carastro, C. Russell, V. Sundaram, M. Swaminathan
{"title":"A novel methodology (Low Temperature Laminated Organics) for 3D integration using multilayer organics","authors":"G. White, S. Dalmia, L. Carastro, C. Russell, V. Sundaram, M. Swaminathan","doi":"10.1109/ECTC.2008.4549947","DOIUrl":null,"url":null,"abstract":"This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using conventional low-loss organic laminates. The new process termed low temperature laminated organics, LTLOtrade [1], is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280degC to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, and any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive components allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.","PeriodicalId":378788,"journal":{"name":"2008 58th Electronic Components and Technology Conference","volume":"65 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 58th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2008.4549947","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using conventional low-loss organic laminates. The new process termed low temperature laminated organics, LTLOtrade [1], is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280degC to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, and any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive components allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.