The effects of the interaction of normal force and wipe distance on contact resistance in precious metal plated contacts

Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts Pub Date : 1900-01-01 DOI:10.1109/HOLM.1988.16099

I. Brockman, C.S. Sieber, R. Mroczkowski

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引用次数: 10

Abstract

The effects of contact normal force and wiping distance on contact resistance were evaluated for hemispherical contacts wiping on flat coupons. Hard- and soft-gold-plated coupons and palladium and gold-over-palladium contacts were used. Two types of wiping action were investigated; wiping under the full normal force of 180 g and wiping during the application of the normal force. The coupon surface conditions used were: clean, lubricated, and lubricated and dust-covered. The lubricated and dust-covered conditions was intended to provide a severe condition for wiping action to penetrate or displace. The effects of cycling were also evaluated. In most cases it was found that wiping distances on the order of >

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法向力与擦除距离的相互作用对镀贵金属触点接触电阻的影响

研究了平面接触面半球面接触面擦拭时接触法向力和擦拭距离对接触阻力的影响。使用了硬镀金和软镀金券，以及钯金和镀钯金的触点。研究了两种类型的擦拭作用;在180g的全法向力下擦拭，并在施加法向力的过程中擦拭。使用的粘片表面条件是:清洁，润滑，润滑和灰尘覆盖。润滑和灰尘覆盖的条件旨在为渗透或置换的擦拭作用提供严格的条件。骑车的效果也进行了评估。在大多数情况下，我们发现擦除距离约为100英尺

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Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts

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