GaAs power MESFET's fabricated by ion implantation technology for 2.4-GHz wireless LAN applications

Y. Lai, E. Chang, C. Chang, Don-Gey Liu, M. Her, M. Shiau, S. Yang, K.C. Chuang
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Abstract

In this paper, we present GaAs power MESFETs fabricated by the ion implantation technology for 2.4-GHz wireless communication applications. The MESFET exhibited a saturation drain current of 850 mA and a maximum transconductance of 145 mS/mm. The 3.36-mm-wide MESFET operating at 2.4 GHz demonstrated an output power of 24.7 dBm and a power-added efficiency of 56.4% at a low drain voltage of 2.5 V.
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采用离子注入技术制备用于2.4 ghz无线局域网的GaAs功率MESFET
本文提出了一种应用于2.4 ghz无线通信的离子注入技术制备的GaAs功率mesfet。MESFET的饱和漏极电流为850 mA,最大跨导为145 mS/mm。3.36 mm宽MESFET工作频率为2.4 GHz,在2.5 V的低漏极电压下,输出功率为24.7 dBm,功率增加效率为56.4%。
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