28nm node bulk vs FDSOI reliability comparison

X. Federspiel, D. Angot, M. Rafik, F. Cacho, A. Bajolet, N. Planes, D. Roy, M. Haond, F. Arnaud
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引用次数: 37

Abstract

In this paper, we present TDDB, HCI and BTI reliability characterization of Nfet and Pfet devices issued from FDSOI and bulk 28nm technologies. 28nm FDSOI devices achieve 32% improved performance, 40% reduced power consumption and improved matching. From device level tests, 28nm FDSOI also demonstrates intrinsic reliability behavior similar to 28 bulk devices, giving confidence in the robustness of this technology.
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28nm节点体与FDSOI可靠性比较
在本文中,我们介绍了FDSOI和批量28nm技术制造的fet和fet器件的TDDB, HCI和BTI可靠性表征。28nm FDSOI器件的性能提高了32%,功耗降低了40%,并改善了匹配。从器件级测试来看,28nm FDSOI也显示出与28块体器件相似的内在可靠性行为,这让人们对该技术的稳健性充满信心。
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