Numerical study of side gate junction-less transistor in on state

A. Dehzangi, F. Larki, B. Majlis, M. Hamidon, M. Navasery, E. Gharibshahi, N. Khalilzadeh, M. Vakilian, E. Saion
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Abstract

Side gate p-type Junctionless Silicon transistor is fabricated by AFM nanolithography on low-doped (105 cm-3) SOI wafer. In this work, the simulation characteristic of the device using TCAD Sentaurus in on state will be studied. The results show that the device is the pinch off transistor, works in on state for zero gate voltage in depletion mode. Negative gate voltage drives the device into on state, but unable to make significant effect on drain current as accmulation mode. Simulation results for valence band energy, electric field and hole density are investigated along the active regions. The influence of the electric field due to the applied voltages of VDS and VG on charge distribution is much more when the device operates at the saturation region. The hole quasi-Fermi level has a positive slope showing the current flows from source to drain.
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边栅无结晶体管导通状态的数值研究
采用AFM纳米光刻技术,在低掺杂(105 cm-3) SOI晶圆上制备了侧栅p型无结硅晶体管。在本工作中,将研究使用TCAD Sentaurus在开启状态下对器件的仿真特性。结果表明,该器件为掐断型晶体管,在耗尽模式下工作在零栅极电压导通状态。负栅极电压驱动器件进入导通状态,但作为累加方式对漏极电流不能产生显著影响。研究了活性区的价带能、电场和空穴密度的模拟结果。当器件工作在饱和区时,由VDS和VG外加电压引起的电场对电荷分布的影响更大。孔准费米能级具有正斜率,表明电流从源极流向漏极。
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