Impact of cell distance and well-contact density on neutron-induced Multiple Cell Upsets

J. Furuta, Kazutoshi Kobayashi, H. Onodera
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引用次数: 29

Abstract

We measured neutron-induced Single Event Upsets (SEUs) and Multiple Cell Upsets (MCUs) on Flip-Flops (FFs) in a 65 nm bulk CMOS process. Measurement results show that MCU / SEU is up to 23.4% and is exponentially decreased by the distance between latches on FFs. MCU rates can drastically be reduced by inserting well-contact arrays between FFs. The number of MCUs is reduced from 110 to 1 by inserting a well-contact array under power and ground rails.
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细胞距离和孔接触密度对中子诱导的多细胞扰动的影响
我们在65nm的体CMOS工艺中测量了触发器(FFs)上中子诱导的单事件扰动(seu)和多单元扰动(mcu)。测量结果表明,MCU / SEU可达23.4%,并随锁存器之间的距离呈指数级下降。通过在ff之间插入良好接触阵列,可以大幅降低MCU速率。通过在电源和地轨下插入良好接触阵列,mcu的数量从110个减少到1个。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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