{"title":"Building a sustainable future for silicon photonics","authors":"R. Baets","doi":"10.1109/GROUP4.2011.6053696","DOIUrl":null,"url":null,"abstract":"Silicon photonics presents immense opportunity for innovation in telecom, datacom and sensing. But how do we build the food chain from research to high volume manufacturing? How do we address the issues associated with design tools, industrial fab capability, test and packaging capability?","PeriodicalId":141233,"journal":{"name":"8th IEEE International Conference on Group IV Photonics","volume":"62 1-2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"8th IEEE International Conference on Group IV Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GROUP4.2011.6053696","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Silicon photonics presents immense opportunity for innovation in telecom, datacom and sensing. But how do we build the food chain from research to high volume manufacturing? How do we address the issues associated with design tools, industrial fab capability, test and packaging capability?
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