Solving the design problems of a ZIF connector to accept leaded LSI packages

Abstract

This paper covers the main steps involved in the design and prototyping of a minimum insertion force connector for Dual In-Line Packages. The required features and the boundary conditions prescribed at the beginning of the projects are presented, along with an analysis leading to the selection of the ultimate design. Stress analysis, configuration compatibility, the considerations given to manufacturing, materials, and processing are also covered. The design of the contact (which is the most critical and complicated part in the connector) is presented in detail. An in-house computer Spring Analysis program referred to as "SPAN" was utilized to optimize the design. The prototype contact tests are also covered.