Guide Wave-Based Inspection of Adhesively Bonded Structures in Composite Plates

Xiaoyan Zhang, Zhoumo Zeng, Jian Li, Yang Liu
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Abstract

The existence of weakly bonded areas will greatly affect the reliability of adhesively bonded structures in composite plates which are widely used in engineering applications. The timely and effective inspection of the adhesively bonded structure is crucial. In this paper, a simulation method of bonded quality based cohesive zone model(CZM) and the RAPID imaging method based ultrasonic guided wave detection technology are proposed to realize the detection and imaging of weakly bonded areas of adhesively bonded structures in composite plates. The CZM is innovatively used for the simulation of different bonded quality, it is achieved by modifying the constitutive relation curve of bilinear traction-separation law. Then, the influence of the degradation of bonded quality on the propagation characteristics of guided waves was explored. The results show that different bonded conditions have a significant impact on the guided wave propagation characteristics which enable the inspection of weakly bonded areas. Finally, based on the guided wave detection method and the cross covariance-based RAPID imaging algorithm, the detection and imaging of the weakly bonded area of the adhesively bonded structures are realized.
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基于导波的复合材料板粘接结构检测
弱粘结区域的存在将极大地影响工程中广泛应用的复合材料板粘接结构的可靠性。及时有效地对粘接结构进行检测至关重要。本文提出了一种基于粘接区模型(CZM)的粘接质量模拟方法和基于超声导波检测技术的快速成像方法,实现了复合材料板中粘接结构弱粘接区域的检测和成像。通过修改双线性牵引-分离律的本构关系曲线,创新地将CZM用于不同粘结质量的模拟。然后,探讨了粘结质量的退化对导波传播特性的影响。结果表明,不同的粘结条件对导波的传播特性有显著的影响,使得检测弱粘结区域成为可能。最后,基于导波检测方法和基于交叉协方差的RAPID成像算法,实现了粘接键合结构弱键合区域的检测与成像。
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