J. Sousa, Sabine Liebfahrt, B. Reitmaier, Maria Prutti, Bernd Schuscha, Q. Tao, J. Nicolics, M. Unger, P. Fulmek
{"title":"Heat Capacitive PCB","authors":"J. Sousa, Sabine Liebfahrt, B. Reitmaier, Maria Prutti, Bernd Schuscha, Q. Tao, J. Nicolics, M. Unger, P. Fulmek","doi":"10.1109/ESTC.2018.8546379","DOIUrl":null,"url":null,"abstract":"This paper describes a heat capacitive PCB concept where phase change materials (PCMs) embedded in an epoxy resin matrix is used. A heat dissipating component is installed on the surface of the PCB containing phase change material filled cavities. During phase change, part of the dissipated heat is absorbed by the PCB with the effect of reducing the operational temperature for the component and expanding the time until the system has reached steady state maximum temperature.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546379","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
This paper describes a heat capacitive PCB concept where phase change materials (PCMs) embedded in an epoxy resin matrix is used. A heat dissipating component is installed on the surface of the PCB containing phase change material filled cavities. During phase change, part of the dissipated heat is absorbed by the PCB with the effect of reducing the operational temperature for the component and expanding the time until the system has reached steady state maximum temperature.
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