{"title":"Extraction of parasitic parameters for QFN32","authors":"Wenjun Xie, G. Wen, Haiyan Jin","doi":"10.1109/YCICT.2009.5382385","DOIUrl":null,"url":null,"abstract":"The Quad Flat No Lead or QFN package, a near CSP lead frame, is a promising choice for portable wireless applications such as BluetoothTM and RF SoC. Excellent attributes of this advanced package include miniaturized footprint, good electrical performance and excellent thermal characteristics. In this paper, the parasitic parameters of one signal path for a typical 32 I/O (0.5 mm pitch)QFN package structure, were extracted precisely using Ansoft HFSS and ADS of the Agilent company.","PeriodicalId":138803,"journal":{"name":"2009 IEEE Youth Conference on Information, Computing and Telecommunication","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Youth Conference on Information, Computing and Telecommunication","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/YCICT.2009.5382385","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The Quad Flat No Lead or QFN package, a near CSP lead frame, is a promising choice for portable wireless applications such as BluetoothTM and RF SoC. Excellent attributes of this advanced package include miniaturized footprint, good electrical performance and excellent thermal characteristics. In this paper, the parasitic parameters of one signal path for a typical 32 I/O (0.5 mm pitch)QFN package structure, were extracted precisely using Ansoft HFSS and ADS of the Agilent company.
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