Group delay analysis of folded multi-layer C-sections used in encoding of chipless RFID tag

Abstract

Researches on modern wireless identification methods have been focused on RFID techniques and in particular on chipless solutions. A parametric study of folded multi-layer C-sections fabricated on flexible substrates and a chipless RFID tag with single group of folded C-sections are presented in this paper. Full-wave simulations have been done for the folded multi-layer C-section and the chipless RFID tag. The obtained results confirm the feasibility of the utilization of this concept with multi-layer C-sections in temporal multi-frequency encoding technique based on group delay. It has been found that the techniques with folded multi-layer structure offer a significant amount of group delay and highly narrow band delay peaks.