{"title":"Development of combined surface activated bonding (SAB) method for hydrophilic wafer bonding","authors":"Ran He, M. Fujino, T. Suga, A. Yamauchi","doi":"10.1109/ICSJ.2014.7009611","DOIUrl":null,"url":null,"abstract":"A new combined surface activated bonding (SAB) technique has been developed for hydrophilic wafer bonding in vacuum. Relative humidity in the bonding environment is not necessary in this novel hydrophilic bonding approach.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE CPMT Symposium Japan 2014","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSJ.2014.7009611","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A new combined surface activated bonding (SAB) technique has been developed for hydrophilic wafer bonding in vacuum. Relative humidity in the bonding environment is not necessary in this novel hydrophilic bonding approach.
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