{"title":"Automated RF/DC Testing of Microwave Device Wafers","authors":"Bernhard Ziegnerr","doi":"10.1109/ARFTG.1987.323863","DOIUrl":null,"url":null,"abstract":"An automated wafer level RF/DC test system useful to frequency above 20 GHz has been developed to characterize and determine acceptability of microwave semiconductor die prior to dicing the wafer. This concept has been implemented by the integration of a programmable wafer prober with both an automated DC and RF automatic network analyzer. The entire measurement is under computer control.","PeriodicalId":287736,"journal":{"name":"29th ARFTG Conference Digest","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1987-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"29th ARFTG Conference Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARFTG.1987.323863","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
An automated wafer level RF/DC test system useful to frequency above 20 GHz has been developed to characterize and determine acceptability of microwave semiconductor die prior to dicing the wafer. This concept has been implemented by the integration of a programmable wafer prober with both an automated DC and RF automatic network analyzer. The entire measurement is under computer control.
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