Present practice of power packaging for DC/DC converters

J. Flannery, P. Cheasty, M. Meinhardt, M. Ludwig, P. McCloskey, C. O'Mathúna
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引用次数: 6

Abstract

This paper presents the results of a detailed benchmarking of the status of power packaging of DC/DC converters in the 100 W range. This work was carried out as part of the StatPEP project which was co-sponsored by the PSMA and PEI Technologies. This benchmarking has established the present best practice in the power electronic packaging of DC/DC power converters currently being manufactured. Ten DC/DC power supplies were identified. The units included two from government and space applications, seven telecom units and one common industrial unit. The main specifications of these supplies are rated power of /spl sim/100 W, input voltage of 48 V and single output voltage (V/sub o/) as low as possible in the range 5 V to 2 V. Electrical and thermal properties were measured to confirm individual data sheet specifications. The investigation comprised an analysis of the physical structure of converters, the nature of external packaging, the type of base plates, substrates and potting compounds used as well as the converter's power/energy/current densities. Also addressed was the interconnect between circuit components, the assembly technology used, overall numbers of components and solder joints and magnetic components (packaging type, technology, level of integration), Of particular interest in the benchmarking process is an analysis of how packaging is used to address thermal and current density issues as well as the identification of suitable figures of merit to quantify the status of power packaging and allow progress to be monitored over time.
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DC/DC变换器电源封装现状
本文介绍了对100w范围内DC/DC变换器电源封装状况的详细基准测试结果。这项工作是由PSMA和PEI Technologies共同发起的StatPEP项目的一部分。该基准测试建立了目前正在制造的DC/DC电源转换器的电力电子封装的最佳实践。确定了10个DC/DC电源。这些单位包括两个来自政府和空间应用的单位、七个电信单位和一个共同工业单位。这些电源的主要规格是额定功率为/spl sim/ 100w,输入电压为48v,单输出电压(V/sub /)在5v至2v范围内尽可能低。测量电学和热学性能以确认单个数据表的规格。调查包括对转换器的物理结构、外部包装的性质、基板的类型、衬底和所使用的灌封化合物以及转换器的功率/能量/电流密度的分析。还讨论了电路元件之间的互连,使用的组装技术,元件和焊点和磁性元件的总体数量(封装类型,技术,集成水平),在基准测试过程中,特别感兴趣的是分析如何使用封装来解决热和电流密度问题,以及确定合适的优点数字来量化电源封装的状态,并允许随着时间的推移监测进展。
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