Wafer probe mark area estimation via digital image processing approach

Chau‐Shing Wang, Wen-Liang Chang
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引用次数: 1

Abstract

This article presents a digital image processing approach applied to estimate the probe mark area on semiconductor wafer pads. The value of mark area can be used to judge the acceptance of the wafer. Before wire bonding to the wafer, a probing needle contacts each pad to test the electrical characteristics of the chip. However, this contact leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this article, we present an imaging processing approach to calculate the probe mark area utilizing high-magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to the traditional method.
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基于数字图像处理方法的晶圆探头标记面积估计
本文提出了一种用于估计半导体晶圆片上探针标记面积的数字图像处理方法。标记面积的大小可以用来判断晶圆片的接受程度。在将导线连接到晶圆片之前,探针接触每个衬垫以测试芯片的电气特性。然而,这种接触会在焊盘上留下探针痕迹。较大的探针标记面积会导致焊盘粘结球处的附着力差,从而导致不良产品。传统上,考虑到计算不规则探测标记面积的困难,用计算人工绘制的覆盖探测标记区域的椭圆形面积来代替探测标记面积的计算。然而,这种方法是不准确的,结果因人而异。在本文中,我们提出了一种成像处理方法来计算探针标记面积利用高倍率显微镜捕获探针标记图像。与传统方法相比,我们的方法更快,更准确。
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