D. Peyrou, P. Pons, A. Nicolas, J. Tao, H. Granier, R. Plana
{"title":"Foturan Cap and BCB Sealing-Ring for RF MEMS Packaging Applications","authors":"D. Peyrou, P. Pons, A. Nicolas, J. Tao, H. Granier, R. Plana","doi":"10.1109/EMICC.2006.282681","DOIUrl":null,"url":null,"abstract":"RF-MEMS switches devices are made of moveable and timy structures (beams) that must be encapsulated in order to protect them from harmful environmental influences, to increase their reliability and lifetime. This paper presents a packaging solution based on a micromachined Foturan cap and BCB sealing. In order to validate the packaging technology, RF switch onto coplanar waveguide lines for 6-18 GHz was designed using HFSS software package, and fabricated. The demonstrator was characterised in terms of return and insertion losses measurements. The agreement between the modelling and the measurements is very good, and validates the technological approach, which assures insignificant impact of the package on the RF losses","PeriodicalId":269652,"journal":{"name":"2006 European Microwave Integrated Circuits Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2006-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 European Microwave Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMICC.2006.282681","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
RF-MEMS switches devices are made of moveable and timy structures (beams) that must be encapsulated in order to protect them from harmful environmental influences, to increase their reliability and lifetime. This paper presents a packaging solution based on a micromachined Foturan cap and BCB sealing. In order to validate the packaging technology, RF switch onto coplanar waveguide lines for 6-18 GHz was designed using HFSS software package, and fabricated. The demonstrator was characterised in terms of return and insertion losses measurements. The agreement between the modelling and the measurements is very good, and validates the technological approach, which assures insignificant impact of the package on the RF losses
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
